Made In Israel

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Sub categories of Electronic
Antennas & RF Systems
EMS-electronic manufacturing services
Embedded Rugged Computers
Board Level EMI/RFI Shielding
Laser illuminators
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Electronic
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Teflon and hybrid boards
Teflon and hybrid boards
Electronic
Flex and multi-flex boards
Flex and multi-flex boards
Electronic
Flex-rigid boards
Flex-rigid boards
Electronic
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Punching Department
Service | From Israel 
Exporter, Manufacturer, Supplier
The factory’s Punching Department is equipped with a variety of punching equipment
Rigid multilayer boards up to 36 layers
Product | From Israel 
Exporter, Manufacturer, Supplier
Rigid multilayer boards up to 36 layers   16-layer rigid board with blind vias for medical  diagnostic equipment.  Rigid multi layer for telecom application.  
Teflon and hybrid boards
Product | From Israel 
Exporter, Manufacturer, Supplier
Teflon TM and hybrid boards 12-layer hybrid board, built with 2 layers of "Duroid" Teflon TM as microstrip and 10    layers of polyimide.    Application: Microwave.   14-layer antenna board (Duroid) - ceramic  based Teflon™ combined with Getek     trademarks laminate and prepreg.    Application: RF Microwave.  
Polishing Department
Service | From Israel 
Exporter, Manufacturer, Supplier
Polishing Department: The department has a full automatic polishing machine, having several polishing options by a number of polishing bands and scratch removers, in addition to other machines and tools for scratches removal from the material surface.
Engineering and Development Department
Service | From Israel 
Exporter, Manufacturer, Supplier
The company’s experienced engineers are very knowledgeable and experienced in the fields of sheet metal processing and integration to electronic parts and metal. All customer requirements are processed by the company’s engineers, with full collaboration and according to the customer’s preferences, the design process is performed using SOLID WORKS CAD software and enables the creation of a comprehensive product file including modeling and detailed drawings. The factory’s Engineering Department was designed to address every and all customer needs.
HDI
Product | From Israel 
Exporter, Manufacturer, Supplier
  Including buried and blind via holes. MICROVIA   Less than 0.1 mm between layer 1 and 2.     Also available between layer 1 and 3,2 and 4,2 and 3,3 and 4.    Aspect ratio up to 1:1  Conductor trace - 3 mil   Space between conductor trace - 3 mil   
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