Micro Point Pro offers various tools desigs to support the Surface Mount Technology (SMT) process. This process is used to assemble components on the PCB board. Micro Point Pro offers unique material combinations and accurate designs which enable:Less vacuum detection errorsReduced components dropsBetter optical recognition with non reflective ceramicHigh geometrical accuracy and repeatability that applies with the strict semiconductor industry requirementsGeometry customizaton capability that meets various applications challengesUnique ceramic Tip can be combined with a wide range of materials (i.e. plastic, metal) that improves the tool's performance and increases producevity

The 4WF wedge models are designed for Fine Pitch applications, usually performed on automatic machines.

The 4WA wedge models are designed to fit the majority of common applications as well as most of the automatic wedge bonders employed in the industry.

The 4WN wedge models are specially designed for Microwave and Hybrid applications. This unique configuration allows minimal stress on the wire

The 4WDwedge models are intended for deep access packages with high or closely positioned walls

The 4WR wedge models are designed to fit applications using ribbon wires. They feature a rectangular hole in which the ribbon can flow easily.

The 4WC wedge models are specially designed to fit COB (Chip On Board) applications.