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Made in Israel Online Exhibition
Special solutions for heat distribution
Special solutions for heat distribution
  Petach Tikva, Israel
Type
Technology

Internal and external heat sinks, 3D heatsink, copper-Invar-copper, 
    heavy copper inner layer, etc.

 16-layer polyimide PCB with heavy copper ground layers (12oz) for 
    extrathermal dissipation. The heavy copper ground layers  are exposed at the edge
    of the PCB for attachment to cold plate assemblies. The  12oz. copper acts as both
    heatsink and  active layers within the PCB.

 

 

 Two 12-layer boards, laminated with copper-nickel. 
    Heat-sink between them. Each 12-layer board has blind/burried vias. 
    Application: Avionics.

 

 

 16-layer rigid polyimide PCB with 0.4 mm copper ground and VCC layers.
    Application: Electro-optic. 

 

 

 12-layer polyimide board with 3-dimensional external aluminium heat sink.

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