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Made in Israel Online Exhibition

 

 

Including buried and blind via holes.

 MICROVIA

   Less than 0.1 mm between layer 1 and 2.  
   Also available between layer 1 and 3,2 and 4,2 and 3,3 and 4. 
   Aspect ratio up to 1:1

  Conductor trace - 3 mil 
  Space between conductor trace - 3 mil
 


 

 

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