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Sub categories of Electronic
Antennas & RF Systems
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Backplanes
Product | From Israel 
Exporter, Manufacturer, Supplier
  Backplane 8 layers for defense application.  
Polishing Department
Service | From Israel 
Exporter, Manufacturer, Supplier
Polishing Department: The department has a full automatic polishing machine, having several polishing options by a number of polishing bands and scratch removers, in addition to other machines and tools for scratches removal from the material surface.
HDI
Product | From Israel 
Exporter, Manufacturer, Supplier
  Including buried and blind via holes. MICROVIA   Less than 0.1 mm between layer 1 and 2.     Also available between layer 1 and 3,2 and 4,2 and 3,3 and 4.    Aspect ratio up to 1:1  Conductor trace - 3 mil   Space between conductor trace - 3 mil   
Rigid multilayer boards up to 36 layers
Product | From Israel 
Exporter, Manufacturer, Supplier
Rigid multilayer boards up to 36 layers   16-layer rigid board with blind vias for medical  diagnostic equipment.  Rigid multi layer for telecom application.  
Special solutions for heat distribution
Technology | From Israel 
Exporter, Manufacturer, Supplier
Internal and external heat sinks, 3D heatsink, copper-Invar-copper,     heavy copper inner layer, etc. 16-layer polyimide PCB with heavy copper ground layers (12oz) for     extrathermal dissipation. The heavy copper ground layers  are exposed at the edge    of the PCB for attachment to cold plate assemblies. The  12oz. copper acts as both    heatsink and  active layers within the PCB.   Two 12-layer boards, laminated with copper-nickel.     Heat-sink between them. Each 12-layer board has blind/burried vias.     Application: Avionics.    16-layer rigid polyimide PCB with 0.4 mm copper ground and VCC layers.    Application: Electro-optic.     12-layer polyimide board with 3-dimensional external aluminium heat sink.
Punching Department
Service | From Israel 
Exporter, Manufacturer, Supplier
The factory’s Punching Department is equipped with a variety of punching equipment
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